As part of the Sparc SuperCluster rollout yesterday, Oracle chief exec officer Larry Ellison let slip that the future Sparc T4 chip was coming out next year. Oracle and Fujitsu also announced a revved up Sparc64-VII+ processor for the Sparc Enterprise M series of midrange and high-end SMP machines, but did not provide any details on future system and chip co-development between the two firms.
It is not entirely clear what the Sparc T4 chip is, but it looks to be a shrink of the current 16-core “Rainbow Falls” Sparc T3 processor, which is fabbed by Taiwan Semiconductor Manufacturing Corp using a 40 nanometer process and which debuted back in September.
Mark your calendars for next Tuesday, August 3rd. We’ve been invited to an exclusive event hosted by AT&T and RIM that day starting at 11am, where it’s most certain that they’ll be blowing the doors off the next big thing from the world of Blackberry.